Thin Pcb Laminate

Zeta cap ultra thin high performance pcb cap material description.

Thin pcb laminate.

Rigid 0 020 n5105 laminate part number. Interra thin copper clad laminates for embedded capacitance. As this blog detailed some years ago thinner printed circuit board pcb laminates offer many electrical benefits as well as mechanical advantages compared to thicker circuit materials especially at higher frequencies reaching into millimeter wave bands. Fr4 tends to have higher losses than other printed circuit board pcb materials that are specialized for rf applications.

Thin boards aren t preferable in all cases primarily due to the limitations thin boards put on pcb plans. The company maintains a high commitment to on going r d efforts and provides a complete portfolio of products ranging from composites to high reliability thermal management hsd and rf ptfe laminate materials. N5305 nelco n5000 bt epoxy laminate and prepreg pcb materials provide superior electrical properties. Bt epoxy laminate and prepreg laminate part number.

Based in dongguan since 1985 shengyi technology co ltd. Cyr sun microsystems inc bob greenlee merix corporation john grebenkemper compaq computer corporation jason gretton aromat corporation a matsushita company. Sytech is a world leader in the development and production of laminates. Thicker boards however can accomplish both.

Dupont interra thin copper clad laminates are specifically designed for use as embedded capacitance materials in multilayer rigid printed circuit boards. Thin fr4 boards can t feasibly feature grooves and they can t be too large without risking fracture. Thin can be a good thing for high frequency circuit laminate materials. They offer the best mechanical strength reliability and capacitance stability on the market.

The n5000 resin system was originally developed for application specific use in high density military. The patent was filed as an improved insulating layer for rigid printed circuit boards. Always account for this when weighing options between fr4 thicknesses. They can be as simple as one or two layers of copper or in high density applications they can have fifty layers or more.

So when it comes to thin laminates think about their inductance rather their capacitance. Sisler method of making multilayer printed circuit board us patent 5 010 641 april 30 1991. Zeta cap a glass free laminate produced by integral technology has received us patent no. Thin pcb laminates for power distribution how thin is thin enough.

Matters is the inductance and thin laminates create very low inductance indeed. These laminates offer significantly improved electrical performance over standard fr4 and often a combination of fr4 and a high speed laminate may be preferable to an alternative fr4 material.